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Machine Vision & 3D Part Inspection
Nozzle & Wafer Inspection

ImageXpert's cutting-edge nozzle and wafer inspection system has revolutionized the way inkjet nozzles are analyzed. By enabling the inspection of nozzle plates before assembly into print heads, time and money can be saved.

The inkjet nozzle plates are examined for morphological defects such as nicks, cuts or blockage. Nozzle size, alignment and spacing can also be quantified. Resolution levels down to one micron are available.

The line scan-camera-based system uses sophisticated multi-axis motion control for automatic adjustment of each part relative to the image sensor plane.

A laser triangulation unit is used to measure the height of each end of each part. The differences between the heights establish the amount of angular correction required prior to inspection. Once the part has been leveled using a goniometer, the laser is then used to measure part height and the camera height is adjusted automatically.

The leveled part is then moved under the line scan camera for seamless image capture and analysis. A line scan camera uses a single row of sensors when capturing an image. In order to build up a full two-dimensional image of an entire nozzle array, multiple 1-D pictures need to be taken while the part is being moved under the camera. Successful line scan camera imaging requires careful synchronization between the motion of the part and the image capture frequency of the camera itself. The result is a seamless image of an entire nozzle array.

Once the image has been captured, nozzle quality is inspected. Inspection can occur concurrently with the image capture to maximize system efficiency. Nozzle quality measurement results can be compared against tolerances for pass/fail part disposition. A "review reject" option allows an operator to visually inspect any rejected part's image on the monitor. Failure modes and results can be used to feed SPC software in real-time, or they can be stored for offline failure analysis for improving manufacturing processes.

Measurements include:

  • Size
  • Position
  • Defect detection
  • Alignment

And many more.